Visit Us Next Week at Bondexpo – 6th – 8th 2026 – Messe Stuttgart!!

With a clear and consistent focus on the joining and bonding process chain—including adhesive bonding, potting, sealing, and foaming—Bondexpo offers cost-effective custom and system solutions for current and future challenges in the field of joining and bonding a wide variety of materials.

More information about Bondexpo can be found at: http://www.bondexpo-messe.de/en

Bondexpo is from the  6th to 8th of  October 2026, at the exhibition center in Stuttgart, Germany. We cordially invite you to visit us at our booth during this time. You will find us in Hall 6 Stand 6422.

We will be exhibiting an assortment of our self-adhesive tapes, as well as die-cut stamped parts, processing equipment and an array of other versatile self-adhesive solutions.

We are look forward to your visit!